The ADG408 and ADG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels respectively. The ADG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1 and A2. The ADG409 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF.
The ADG408/ADG409 are designed on an enhanced LC2MOS process which provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs. The ADG408/ADG409 are improved replacements for the DG408/DG409 Analog Multiplexers.
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Audio and Video RoutingAutomatic Test EquipmentData Acquisition SystemsBattery Powered SystemsSample and Hold SystemsCommunication Systems
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44 V Supply Maximum RatingsVSS to VDD Analog Signal RangeLow On Resistance (100 V max)Low Power (ISUPPLY < 75 mA)Fast SwitchingBreak-Before-Make Switching ActionPlug-in Replacement for DG408/DG409
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VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to 25 V
Analog, Digital Inputs2 . . . . . VSS 2 V to VDD +2 V or 20 mA,
Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . 40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . 55°C to +125°C
Storage Temperature Range . . . . . . . . . . .65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . 900 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . 470 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155°C/W
JC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50°C/W
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 600 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature,
Post a Buying Lead
Required Field 
